Wafer dicing services can be performed by using various processes.

Wafer dicing services can be performed by using various processes. Some common processes include Ion implantation, Laser ablation, Photolithography, and Stealth dicing. Learn more about these processes and find the right one for your wafer dicing needs. A professional will be able to guide you through each step. Here are some of the advantages of each process. Here are some tips for deciding which one is right for your project:

Photolithography

The Photolithography process involves inscribed defects on silicon wafers. This is done by focusing a pulsed Nd:YAG laser that matches the band gap in silicon. The laser is optically focused at various depths on the wafer to inscribe defects of 10 um. The optical micrograph shows a defect region inscribed by the laser beam. Photolithography wafer dicing services ensure quality results by minimizing the cost and time spent on processing.

This service involves a number of backend processes, such as dicing and wafer thinning. Thin wafers reduce overall device profiles while exposing embedded materials. Atomica offers a variety of wafer dicing services that enable precise thickness control. Atomica thins wafers to fit specified thickness profiles and packages. We can polish heterogeneous material sets for easier manufacturing. The following services are offered by Atomica:

Ion implantation

Ion implantation is a technique that can be used for small chemical changes in wafers. Typically, the ion ranges are just a few degrees off-axis. A single degree of off-axis alignment error will produce a measurable difference in implantation depth. The same is true for a few degrees of on-axis alignment error. Therefore, it is crucial to follow the instructions carefully and avoid any misalignments.

When using ion implantation, ions of one element are accelerated into a solid target. The ions eject atoms from the target surface, affecting its chemical and physical properties. They also disrupt the crystal structure and cause nuclear transmutation. This process is often followed by thermal annealing, a process that allows the atoms to return to their original positions.

Laser ablation

Laser ablation for wafer dicing is a solid-level processing method that has several benefits. The technique can be used to eliminate the fine wiring layer on the surface of the wafer, reducing the chipping and peeling of layers and improving throughput. This method is suitable for low-k-materials like aluminum nitride and alumina ceramics. The laser pulses can also cause thermal effect on the surface of the wafer, so the cutting speed is slow, which will affect throughput.

A common challenge in laser ablation is removing the material in the kerf. The thickness of a wafer is 500 um, which is equivalent to the space between two three-story houses. A 20um-wide kerf can be equated to fourteen inches, so it would be difficult to throw a ball out of such a small gap. Although some ultra-short pulsed lasers are capable of removing material in a kerf, they are still expensive.

Stealth dicing

Whether your needs are high volume production or research and development, there are a few key benefits to leveraging stealth wafer dicing services. This process is particularly effective for high-density electronics, where computing power must be packed into smaller packages. Stealth wafer dicing is a versatile technology, which is available from qualified suppliers. Read on to discover the advantages of enlisting stealth wafer dicing services for your company.

In the process, a laser beam is used to focus on a point on the wafer’s internal surface. This creates a controlled crack plane, which leads to die separation. The closer the laser beam is to the active surface, the less energy is required. In addition, the laser beam produces very little heat. Because it doesn’t create any heat, this process is highly suitable for semiconductor manufacturing.

Mechanical sawing

The goal of mechanical sawing for wafer dicing is to create a thin cut that separates two or more dies. The width of the saw street can be varied depending on the type of product and the further processing required. The most common frame used by Die Devices is the Disco FFP-200 frame, but other output frames are available, subject to setup tooling and volume levels. Additional capacity can achieve up to 5000UPH throughput and allow for 24-hour operation of volume bare-die sort-and-place operations.

For the purpose of this study, the width of the saw street was reduced from a former industry standard of 85 um to 60 um, and finally, down to 50 um. With the shrinking of saw streets, the size of dies is correspondingly decreased. This narrow scribe width increases the difficulty of the dicing process. The resulting chippings can enter the die guard ring or the active area of the wafer.

Ultrasonic dicing

The benefits of ultrasonic wafer dicing are many. It has the advantage of reducing backside and frontside chipping. It is also able to process materials like silicon carbide. These advantages make ultrasonic dicing a great choice for manufacturers of semiconductors and other materials. Listed below are just some of the advantages of ultrasonic dicing. These services are very cost-effective and can reduce your manufacturing costs.

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